Relife RL-044 IPZ16 IP17-A19/A19Pro CPU Stencil

Description

The Relife RL-044 IPZ16 is a high-precision BGA reballing stencil specifically engineered for the latest generation of smartphone processors. Featuring 0.12mm thickness and laser-cut apertures, it ensures perfect solder ball formation for high-performance CPU repair.

Key Features

• Latest Chipset Support: Precision-molded specifically for A19 and A19 Pro series processors used in modern flagship devices.

• Laser-Cut Square Holes: Advanced manufacturing ensures square apertures that prevent solder paste from sticking and ensure uniform ball height.

• Anti-Drum Design: Engineered to resist heat expansion and “drumming” during the heating process, maintaining a perfectly flat contact with the chip.

• High-Grade Imported Steel: Durable, high-temperature resistant material that maintains its edge and alignment after repeated use.

Technical Specifications

• Thickness: 0.12mm

• Material: Japanese Imported Steel

• Model Compatibility: IP17 / A19 / A19 Pro Series

• Hole Type: Precision Square

Potential Applications Professional CPU reballing, logic board repair, and chipset refurbishment for high-end smartphones.

Package Includes

• 1x Relife RL-044 IPZ16 CPU Stencil