Relife RL-044 BGA Stencils (0.12mm)

Description

The Relife RL-044 is a series of high-precision BGA reballing stencils crafted for modern smartphone ICs. Featuring a 0.12mm thickness and laser-cut square holes, these stencils ensure perfect solder ball alignment and consistent volume for every repair.

Key Features

• Precision Square Holes: Laser-cut apertures prevent solder balls from sticking and ensure even distribution.

• Optimal 0.12mm Thickness: Balanced for structural strength while allowing the perfect amount of solder paste for reballing.

• High-Temperature Resistance: Made from durable steel that resists warping under the heat of a hot air gun.

• Accurate Positioning: Precisely molded to match the pin-out of specific iPhone and Android processors and ICs.

Technical Specifications

• Thickness: 0.12mm

• Hole Design: Precision Square / Rounded

• Material: High-grade imported steel

• Compatibility: Various specific models (0.3/0.35/0.4/0.5 pitch)

Potential Applications BGA reballing for CPUs, RAM, and Power ICs; logic board chip refurbishment.

Package Includes

• 1x Relife RL-044 Precision BGA Stencil (Specify Model)