MC XZ10 Solder Ball (0.2mm / 0.4mm / 0.5mm)

Description

The MC XZ10 series features high-precision BGA solder balls designed for professional chip reballing and IC repair. These high-purity spheres ensure uniform heat distribution and strong mechanical bonds, making them essential for repairing motherboards in smartphones, laptops, and other advanced electronics.

Key Features

• High Purity Lead-Free Alloy: Ensures excellent electrical conductivity and reliability for long-term use.

• Uniform Sphere Sizing: Consistent ball diameter prevents bridging and ensures even contact during the reflow process.

• Oxidation Resistant: Specially treated surface maintains solderability even after long storage periods.

• Smooth Flow: Designed to wet quickly with flux for a perfect spherical finish on BGA pads.

Technical Specs

• Model: XZ10

• Available Diameters: 0.2mm, 0.4mm, 0.5mm

• Container: Protective sealed bottle to prevent moisture and contamination

• Type: BGA Reballing Solder Spheres

Applications

Used for BGA (Ball Grid Array) chip reballing, CPU repair, and GPU servicing in mobile phones and computing hardware.

Package Includes

1x Bottle of MC XZ10 Solder Balls (Selected Diameter)