MC R300 Wick Wire (1515 / 2515)

Description

The MC R300 is a high-quality desoldering braid designed for the efficient removal of excess solder from circuit boards. Made from high-purity oxygen-free copper, it features a specialized geometric weave that acts like a sponge to pull solder away from delicate pads without damaging the PCB.

Key Features

• Oxygen-Free Copper: High-grade copper ensures maximum thermal conductivity and suction power.

• No-Clean Flux Coating: Pre-saturated with high-quality flux to accelerate solder absorption.

• Ergonomic Spool: Designed for easy handling and precise application on tight components.

• Fast Thermal Response: Absorbs solder quickly to minimize heat exposure to sensitive ICs.

Technical Specs

• Model: R300

• Series Variants: 1515 (1.5mm width), 2515 (2.5mm width)

• Length: Standard 1.5M spool

• Material: Braided Copper

Applications

Ideal for cleaning BGA pads, removing solder bridges, and desoldering surface-mount components.

Package Includes

1x Spool of MC R300 Wick Wire