Description
The MC XGS P50 is a premium grade solder paste that offers a larger quantity for busy workshops. Its refined formula provides superior conductivity and a bright, reliable finish on every solder joint, ideal for technicians who demand consistent performance.
Key Features
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Extra Quantity: 42g jar for high-volume repair environments.
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Fine Particle Size: Perfect for fine-pitch stencils and micro-soldering.
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Low Residue: Leaves very little flux residue after soldering, making cleanup easy.
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High Reliability: Tested for long-term stability in mobile device circuits.
Technical Specifications
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Model: XGS P50
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Weight: 42g
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Type: 183°C Lead-Containing
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Consistency: Smooth, non-dry formula
Potential Applications
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Professional smartphone motherboard repair and high-density PCB assembly.
Package Includes
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1x 42g Jar of XGS P50 Solder Paste




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