MC XG50 Special Solder Paste 35Gram

Description

MC XG50 is a high-quality solder paste designed for professional electronics repair. With a 183°C melting point, it offers excellent wetting and strong bond strength, making it the industry standard for general SMD component replacement.

Key Features

• Optimal Viscosity: Flows easily into stencils while maintaining its shape on the pads.

• Smooth Soldering: Reduces the risk of solder bridges and cold joints.

• Long Shelf Life: Formulated to resist drying out in the jar.

• Strong Adhesion: Ensures components stay in place during the reflow process.

Technical Specifications

• Model: XG50

• Melting Point: 183°C

• Weight: 35g

• Composition: Sn63/Pb37

Potential Applications

• General PCB repair, reballing ICs, and SMD component soldering.

Package Includes

• 1x 35g Jar of XG50 Solder Paste