Description
The MC XG30 is a compact-sized solder paste jar, perfect for low-volume repairs or for technicians who want to keep their paste fresh. It features the same reliable 183°C formula as the XG50 but in a more portable 16g container.
Key Features
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Compact Size: Reduces waste for occasional repair tasks.
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High Purity: Made from high-grade raw materials for clean soldering.
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Easy Application: Works well with both manual spatulas and stencils.
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Rapid Melting: Consistent performance under hot air or soldering iron.
Technical Specifications
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Model: XG30
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Weight: 16g
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Melting Point: 183°C
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Packaging: Air-tight screw cap jar
Potential Applications
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Individual hobbyist projects, field repairs, and small SMD work.
Package Includes
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1x 16g Jar of XG30 Solder Paste




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