MC LW50 138°C Solder Paste 50G

Description

MC LW50 is a low-temperature solder paste with a 138°C melting point, specifically designed for heat-sensitive components. It allows for safe repair of middle layers and plastic-housed parts that cannot withstand standard high temperatures.

Key Features

• Low Melting Point: Protects sensitive ICs and prevents board warping.

• Perfect for Middle Frames: Ideal for joining iPhone middle layers safely.

• Bright Joints: Dries to a clean, silver finish with high conductivity.

• Stable Formula: Resists oxidation and ensures a durable connection.

Technical Specifications

• Model: LW50

• Melting Point: 138°C

• Weight: 50g

• Type: Low-Temp BiSn (Bismuth-Tin)

Potential Applications

• Multi-layer motherboard rejoining, plastic connector repair, and CPU reballing.

Package Includes

• 1x 50g Jar of LW50 Low-Temp Paste