Description
The Relife RL TK4 is a specialized high-precision blade designed for removing difficult adhesives, such as CPU black glue and underfill. Its unique geometry allows for precise scraping between tightly packed components on a logic board.
Key Features
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Ultra-Thin Precision Profile: Designed to penetrate microscopic gaps between IC chips and the PCB substrate.
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Heat-Resistant Steel: Can be used under high temperatures from a hot air gun without losing its edge or structural integrity.
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Polished Safety Edge: Optimized to glide over solder pads without causing scratches or damage to the board surface.
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Durable Alloy Construction: Built from high-strength steel to resist bending or snapping during heavy-duty scraping.
Technical Specifications
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Material: Specialized High-Carbon Steel
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Application: CPU/IC black glue removal
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Design: Non-stick, high-flexibility blade
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Quantity: 3-Piece set
Potential Applications Removing underfill from mobile phone CPUs, cleaning solder mask residues, and scraping frame adhesives.
Package Includes
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1x Relife RL TK4 Glue Removal Blade Set
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