Description
Mechanic TF350 is a high-viscosity flux paste specifically formulated for Ball Grid Array (BGA) reballing and soldering. It provides the necessary “sticky” surface to hold solder balls in place and ensures they reflow perfectly into a spherical shape.
Key Features
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BGA Specialist: Engineered to handle the unique thermal requirements of chip-level reballing.
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Excellent Surface Tension: Encourages solder balls to center themselves on pads during reflow.
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Heat Resistant: Does not dry out or burn even during the long heating cycles required for BGA work.
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Syringe Compatible: Packaged for easy transfer to a syringe for point-to-point application.
Technical Specifications
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Model: TF350
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Function: BGA Reballing / Chip Soldering
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Consistency: Thick, high-tack paste
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Residue Type: Transparent / No-Clean
Potential Applications
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Reballing smartphone CPUs, Power ICs, and NAND flash memory chips.
Package Includes
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1x Jar/Tube of TF350 BGA Flux
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