Description
The MC iSm3 is a companion to the iSm5, offering a slightly different viscosity for ultra-fine trace repairs. It is the technician’s choice for the most microscopic jumper work where precision and a clean bond are the highest priorities.
Key Features
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Ultra-Fine Precision: Optimized for use with the thinnest jumper wires available (0.01mm).
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Strong Bonding: Creates a permanent anchor for repaired traces once cured with UV light.
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Refined Formula: Reduces the “blooming” effect, keeping the repair area small and neat.
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Professional Grade: Used in top-tier logic board repair labs worldwide.
Technical Specifications
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Model: iSm3
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Target: Micro-Trace / Pad Repair
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Packaging: Precision-sealed container
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Compatibility: Works with standard UV curing lamps
Potential Applications
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Advanced logic board trace reconstruction and micro-BGA pad repair.
Package Includes
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1x Jar of iSm3 Jumper Wire Paste




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