MC UFO Universal Stencil

Description

The MC UFO Universal Stencil is a high-precision BGA reballing tool designed with a unique circular layout to maximize versatility. Made from high-quality heat-resistant steel, it features various common pitch and grid patterns, allowing technicians to reball a wide range of IC chips with a single, durable stencil.

Key Features

• Universal Grid Patterns: Optimized layout covers the most frequently used BGA chip sizes and pitches.

• High-Temperature Resistance: Precision-cut steel maintains its shape and flatness even under extreme heat during soldering.

• Precision Laser Cutting: Square-hole design ensures better solder paste release and perfectly formed solder balls.

• Anti-Warping Design: Engineered to dissipate heat evenly, preventing the stencil from bulging during the reballing process.

Technical Specifications

• Model: UFO Universal

• Material: High-grade Japanese steel

• Hole Type: Precision Square/Round hybrid

• Thickness: Ultra-thin for precision reballing

Applications

Great for: General IC reballing, SMD component repair, and laboratory prototyping.

Package Includes

• 1x MC UFO Universal Stencil