MC S60 BGA/IC Glue Removing Liquid

Description

The MC S60 is a specialized chemical solvent designed to soften the tough underfill and epoxy glues used to secure IC chips to motherboards. It allows technicians to remove chips without damaging the delicate copper pads underneath, significantly increasing the success rate of CPU and NAND repairs.

Key Features

• Rapid Penetration: Quickly breaks down the molecular bonds of hardened black and white underfill glues.

• Pad Protection: Formulated to be gentle on PCB traces while aggressively attacking the adhesive.

• Minimal Odor: Low-fume formula designed for a more comfortable workshop environment.

• Precision Bottle: Supplied in a small, concentrated bottle for targeted application.

Technical Specifications

• Model: S60 (Optimized for iPhone)

• Type: Underfill Softener

• Volume: 30ml Concentrated Liquid

• Compatibility: All major smartphone motherboard glues

Applications

Ideal for: iPhone CPU reballing, NAND flash upgrades, and removing black epoxy from SMD components.

Package Includes

• 1x MC S60 Glue Removing Liquid